DC-5c-2010P-01R Die Chip

Description

A small piece of the reverse die surface fractured away, producing a raised bump on this 2010 Philadelphia Mint Jefferson Nickel — a die chip variety cataloged as DC-5c-2010P-01R by Cuds on Coins. Die chips form through metal fatigue in the die surface when localized stress causes a tiny fragment to separate from the die face, leaving a void that fills with metal under striking pressure. The resulting raised bump appears on every coin struck from the damaged die until it is retired. No cross-references to other attribution systems are currently known for this variety. The 2010 Jefferson Nickel marked the fifth year of the Return to Monticello reverse design, and Philadelphia produced approximately 260.44 million nickels that year — a relatively moderate output compared to peak production years. The "01R" in the catalog designation indicates this is the first documented die chip on the reverse for the 2010-P date. Die chips are among the most common forms of die deterioration and range from microscopic bumps barely visible under magnification to substantial raised areas that alter the coin's appearance significantly. While they are generally considered minor varieties compared to doubled dies or repunched mintmarks, die chip collectors appreciate them as direct physical evidence of die degradation, and the systematic documentation by Cuds on Coins allows researchers to track patterns of die failure across dates, denominations, and mint facilities.

Attribution History

• Discovered by Pam Hayton
• Expert attribution by Cuds on Coins

External References