DC-1c-2017P-02 Die Chip

Description

Documented by Cuds on Coins, DC-1c-2017P-02 records a die chip on the 2017 Philadelphia Mint Lincoln Shield Cent that has progressed to a later stage than its initial discovery state, with commentary noting horizontal displacement visible as a "white arrow" feature on the struck coin. Die chips represent localized surface failures where a small fragment of die steel separates from the working face, leaving a void that fills with metal during striking and produces a raised bump on the finished coin. Unlike cuds, which involve the die rim, die chips occur within the interior design area and tend to be smaller but can appear at any location on the coin's surface. The horizontal displacement noted in the comments suggests this particular chip has evolved beyond a simple circular bump — the die metal around the initial chip site has shifted laterally, creating a directional feature that distinguishes the later die state from earlier strikes where the chip presented as a more symmetrical raised dot. Lyndall Bass's Lincoln Shield reverse, introduced in 2010, features a union shield with horizontal and vertical lines representing the states, and the geometric precision of the shield design makes die chips particularly noticeable against the regular pattern of lines and bands. The 2017-P cent carries the P mintmark that was added to cents beginning in 2017 to commemorate the U.S. Mint's 225th anniversary — the first time Philadelphia cents bore a mintmark in the denomination's history. Stage progression on die chips provides a chronological record of die deterioration that collectors can sequence through comparative analysis of multiple specimens.

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