DC-1c-2017P-01 Die Chip

Description

A small but cataloged die chip on the reverse of the 2017 (P) Lincoln Shield Cent, this variety documents a localized die deterioration event on Philadelphia's modern cent production. Die chips occur when a tiny fragment of the die surface breaks away, leaving a small void that fills with metal during striking and produces a raised bump on the finished coin. Unlike die cracks, which create linear raised lines, die chips are typically rounded or irregular in shape, appearing as isolated dots or lumps on the coin's surface. The DC-1c-2017P-01 designation identifies this as the first cataloged die chip variety for the 2017-P Shield Cent, part of the Lincoln Shield reverse series introduced in 2010 to replace the Lincoln Memorial design that had served since 1959. While die chips on modern high-mintage issues are relatively common due to the enormous volume of coins struck per die pair, cataloged examples with specific designations provide variety collectors with identifiable targets. The 2017 Philadelphia Cent was produced in large quantities, and locating this particular chip requires careful reverse examination under magnification to distinguish it from general contact marks.

Attribution History

• Discovered by Christopher Rhodes
• Cross reference: Die Chip on reverse.
• Expert attribution by Cuds on Coins

External References