DC-1c-1992-01R Die Chip

Description

Cataloged on the reverse of a 1992 Philadelphia Lincoln cent, DC-1c-1992-01R documents a die chip — a small fragment of die surface that broke away, leaving a tiny void in the die that produces a corresponding raised bump on every coin struck afterward. Die chips are the smallest category in the die failure spectrum, sitting below die cracks and cuds in both scale and visual impact, yet they are significant diagnostically because each chip creates a unique mark at a precise location that serves as a fingerprint for that specific die. The distinction between a die chip and a cud is one of scale and mechanism: where a cud involves a substantial section of die rim fracturing and separating, a die chip involves a localized flake of die steel popping out from the interior surface, often near a design element where the engraved relief creates stress concentration points. On the Lincoln Memorial reverse, common chip locations include the junctions of columns with the stylobate, the angles of the cornice, and the serifs of legend letters — anywhere the die's engraved topography creates a sharp geometric transition that concentrates striking forces. No cross-reference numbers have been established for this variety in other attribution systems. Struck at Philadelphia on copper-plated zinc planchets, 2.5 grams, 19mm, plain edge.

Attribution History

• Discovered by Vivien Bullard
• Expert attribution by Cuds on Coins

External References