DC-1c-2014-02 Die Chip

Description

Die chips are among the most frequently encountered die deterioration varieties in modern U.S. coinage, forming when small fragments break away from the die surface and leave corresponding raised bumps on every subsequently struck coin. DC-1c-2014-02 on the 2014 Lincoln Shield Cent records the second cataloged die chip from this Philadelphia Mint date, documenting a specific die that shed a fragment during its working life. Unlike die cracks, which trace linear paths across the die face, die chips produce isolated raised areas whose shape and size depend on the geometry of the detached fragment. The zinc-core copper-plated cent composition standard since 1982 creates particular stress on dies, and Philadelphia's high-volume production means each working die strikes thousands of coins before retirement, increasing the probability of localized die fatigue. Each die chip is unique in its position, size, and contour, making individual catalog entries distinguishable even when multiple chips exist for a single date. Philadelphia Mint production. Cataloged and verified by Cuds on Coins.

Attribution History

• Discovered by Chuck Newman
• Expert attribution by Cuds on Coins

External References