View All 1961 (D) Lincoln Memorial Cent

1961-D Repunched Mintmark RPM-019

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1961 (D) Cent Repunched Mint Mark error coin
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Verified LegacyRepunched Mint Mark

Attribution

V

Verified by

VarietyVista

Market Value
N/A
Rarity Index
N/A
Discovery Date
1961
Last Sold
N/A

Description

RPM-019 on the 1961-D Lincoln Memorial Cent is documented by VarietyVista across two die marriage records — DMR-090 (UVC-1065) and DMR-028 (UVC-791) — with five die stages recording the obverse die's service through two reverse pairings. Under the first pairing (DMR-090, UVC-1065), Stage A presents a mix of obverse and reverse diagnostics at Early Die State: a die scratch running from the back of the head to the TY of LIBERTY on the obverse, while the reverse already shows die chips on column 1 at LDS, along with depressions under the left base, under the right base, and at the right eave. This combination of a fresh obverse with an advanced reverse suggests the obverse was installed as a replacement into a press still running a deteriorated reverse die. When the failing reverse was replaced (DMR-028, UVC-791), Stage B shows the obverse at Mid Die State paired with a fresh EDS reverse. Stage C advances to Late-Mid Die State (LMDS) on the obverse, with a die crack appearing on the forehead and die chips forming on columns 1 and 2 at MDS. By Stage D, the forehead die crack has grown stronger at LDS, and the reverse has reached LMDS. The terminal Stage E finds the obverse at Very Late Die State (VLDS) with a die chip on the right cornice and a die break on column 12 at LDS on the reverse. The die's history reveals that both reverse dies it was paired with suffered significant columnar and architectural damage, suggesting the obverse die may have been used in a press position particularly prone to reverse die stress.

Die Markers

  • UVC-1065
  • DMR-090
  • Stage A:
  • Die scratch back of head to TY of LIBERTY – EDS
  • Die chips on column # 1 – LDS
  • Depression under Left base
  • Depression under Right base
  • Depression at Right eave
  • UVC-791
  • DMR-028
  • Stage B:
  • Obverse is MDS
  • Reverse die changed – EDS
  • Stage C:
  • Die crack on forehead – LMDS
  • Die chips on column # 1 and # 2 – MDS
  • Stage D:
  • Stronger die crack on forehead – LDS
  • Reverse is LMDS
  • Stage E:
  • Obverse is VLDS
  • Die chip on Right cornice – LDS
  • Die break on column #12

External References

Last updated: July 10, 2026