DC-1c-1955-03 Die Chip

Description

Listed as the third die chip variety for the 1955 Philadelphia Lincoln wheat cent, DC-1c-1955-03 records a location where a small piece of the die surface fractured away, leaving a void that transferred as a raised metallic lump on struck coins. Die chips are among the most common die break varieties because the extreme pressures of coin striking — combined with the repetitive impact cycle that a single die endures across hundreds of thousands of impressions — inevitably create micro-fractures in the hardened steel surface. The 1955 date is one of the most variety-rich years in the wheat cent series, anchored by the famous 1955 Doubled Die Obverse but extending to dozens of lesser-known die anomalies including chips, cracks, and cuds cataloged by specialists. While die chips lack the dramatic visual impact of doubled dies, they serve as die identification markers that help researchers track individual dies through their production life and map die state progressions. Attributed by Cuds on Coins, this variety contributes to the comprehensive documentation of 1955 Philadelphia die failures.

Attribution History

• Discovered by JC Stevens
• Cross reference number: none. 09/01/2013.
• Expert attribution by Cuds on Coins

External References