View All 1961 (D) Lincoln Memorial Cent

1961-D Repunched Mintmark RPM-020

Error
1961 (D) Cent Repunched Mint Mark error coin
Click to zoom
Verified LegacyRepunched Mint Mark

Attribution

V

Verified by

VarietyVista

Market Value
N/A
Rarity Index
N/A
Discovery Date
1961
Last Sold
N/A

Description

Featuring an evolving secondary mintmark and extensive reverse architectural damage, RPM-020 on the 1961-D Lincoln Memorial Cent is cataloged by VarietyVista across two die marriage records — DMR-029 (UVC-792) and DMR-030 (UVC-793) — with five die stages. Under the first pairing (DMR-029, UVC-792), Stage A identifies the variety in Early Die State (EDS) with a notable diagnostic observation: no outside lower loop is visible for the secondary mintmark at this stage. Additional reverse markers include a die chip on the left baseline at LDS, a die chip at the left upper base, a die break at the top of the right cornice with no die crack yet connecting the cornice to the roof, and a die chip on the E of CENT. Stage B advances to Mid Die State (MDS) and reveals that the outside lower loop of the secondary mintmark has now become visible — an unusual case where the secondary mintmark impression became more apparent as the die wore, rather than less. A die crack connecting the right cornice to the roof has also developed at MDS. Stage C (LMDS obverse) adds a small die chip at the left base tip at MDS, a die break on column 12, and a die crack on column 1. Stage D (LDS obverse) sees the left base tip die chip grow to medium size at VLDS, with a stronger die crack on column 1. When the reverse was changed (DMR-030, UVC-793), Stage E shows the obverse at VLDS with die cracks forming northwest on the shoulder, over the ear to the forehead, and in the hair, paired with a fresh EMDS reverse. The progressive appearance of the secondary mintmark from invisible to visible across Stages A and B is a particularly noteworthy diagnostic phenomenon.

Die Markers

  • UVC-792
  • DMR-029
  • Stage A:
  • No outside lower loop for secondary mintmark – EDS
  • Die chip on left base line – LDS
  • Die chip at Left upper base
  • Die break at top of Right cornice
  • No die crack connecting Right cornice to roof
  • Die chip on E of CENT
  • Stage B:
  • Outside lower loop for secondary mintmark – MDS
  • Die crack connecting Right cornice to roof – MDS
  • Stage C:
  • Obverse is LMDS
  • Small die chip at Left base tip – MDS
  • Die beak on column #12
  • Die crack on column # 1
  • Stage D:
  • Obverse is LDS
  • Medium die chip at left base tip – VLDS
  • Stronger die crack on column # 1
  • UVC-793
  • DMR-030
  • Stage E:
  • Die crack Northwest on shoulder – VLDS
  • Die crack over ear to forehead
  • Die crack in hair
  • Reverse die changed – EMDS

External References

Last updated: July 10, 2026