1961-D Repunched Mintmark RPM-004

Description

Representing an extraordinary case of die longevity, RPM-004 on the 1961-D Lincoln Memorial Cent is documented by VarietyVista across three die marriage records — DMR-007 (UVC-770), DMR-008 (UVC-771), and DMR-009 (UVC-772) — with a remarkable fourteen die stages spanning the letters A through N. This is an exceptional survival record for a single obverse die, as the three reverse die pairings confirm the obverse outlasted two reverse dies before finally being retired with a third. Under the first die pairing (DMR-007, UVC-770), Stage A shows the obverse in early die state and the reverse in mid die state. Stage B introduces a thin die crack on the shoulder at early-mid die state, with small die chips forming on Memorial columns 1, 11, and 12 in late-mid die state. Stage C finds the obverse at early-mid die state with a depression forming at the right eave in late-mid die state. Stage D (mid die state obverse) sees the right eave depression develop into a full die break in late die state. Stage E (mid die state obverse) adds a die chip on column 10 in very late die state along with a die chip at the right base tip. The second die pairing (DMR-008, UVC-771) begins at Stage F with the obverse in late-mid die state and a fresh early-mid die state reverse. Stage G brings a die chip in the lower R of LIBERTY at late die state, with the reverse at mid die state. Stage H shows a die chip east of V.D.B. at late die state, with the reverse progressing to late-mid die state. Stage I (late die state obverse) sees a depression forming at the right eave in late-mid die state — a pattern echoing the first reverse pairing's deterioration. Stage J (late die state) produces a small die break at the right eave in late die state. Stage K (very late die state) escalates to a large die break at the right eave, a depression at the right eave, and a thin die crack at the left base tip. Stage L (very late die state) shows the right eave die break growing larger in very late die state, with a die chip on column 12. Stage M (very late die state) introduces a die break under the left base in very late die state. The third and final die pairing (DMR-009, UVC-772) yields Stage N, where the obverse has reached very late die state and a fresh early die state reverse has been installed, with a die gouge visible through the N of UNITED. The fourteen-stage progression across three die marriages makes RPM-004 one of the most thoroughly documented repunched mintmark varieties in the entire Lincoln Memorial cent series, providing an unparalleled record of a single obverse die's journey from early service through terminal deterioration.

Die Markers

• UVC-770
• DMR-007
• Stage A:
• Obverse is EDS
• Reverse is MDS
• Stage B:
• Thin die crack on shoulder – EMDS
• Small die chips on column # 1, 11, and 12 – LMDS
• Stage C:
• Obverse is EMDS
• Depression at Right eave – LMDS
• Stage D:
• Obverse is MDS
• Die break at Right eave – LDS
• Stage E:
• Obverse is MDS
• Die chip on column #10 – VLDS
• Die chip at Right base tip
• UVC-771
• DMR-008
• Stage F:
• Obverse is LMDS
• Reverse die changed – EMDS
• Stage G:
• Die chip in lower R of LIBERTY – LDS
• Reverse is MDS
• Stage H:
• Die chip East of V.D.B. – LDS
• Reverse is LMDS
• Stage I:
• Obverse is LDS
• Depression at right eave – LMDS
• Stage J:
• Obverse is LDS
• Small die break at Right eave – LDS
• Stage K:
• Obverse is VLDS
• Large die break at Right eave – LDS
• Depression at Right eave
• Thin die crack at Left base tip
• Stage L:
• Obverse is VLDS
• Larger die break at Right eave – VLDS
• Die chip on column #12
• Stage M:
• Obverse is VLDS
• Die break under Left base – VLDS
• UVC-772
• DMR-009
• Stage N:
• Obverse is VLDS
• Reverse die changed – EDS
• Die gouge through N of UNITED

External References